Detecting and Measuring Defects in Wafer Die Using GAN and YOLOv3
This research used deep learning methods to develop a set of algorithms to detect die particle defects.Generative adversarial network (GAN) generated natural and realistic images, which improved the ability of you only look once version 3 (YOLOv3) to detect die defects.Then defects were measured based on the bounding boxes predicted by YOLOv3, whic